A fully-integrated flexible photonic platform for chip-to-chip optical interconnects

Journal of Lightwave Technology

Volumn 31, Issue 24, 2013, Pages 4080-4086

  Li, Lan ^a   Zou, Yi ^a   Lin, Hongtao ^a   Hu, Juejun ^a   Sun, Xiaochen ^b   Feng, Ning Ning ^b   Danto, Sylvain ^c   Richardson, Kathleen ^c   Gu, Tian ^a   Haney, Michael ^a  

^a UNIVERSITY OF DELAWARE   (United States)

^b LaXense Inc   (United States)

^c UNIVERSITY OF CENTRAL FLORIDA   (United States)

Author keywords

Data communications; energy per bit; optical interconnects; optical waveguides

Indexed keywords

DATA-COMMUNICATION; ENERGY-PER-BIT; EXPERIMENTAL CHARACTERIZATION; FLEXIBLE SUBSTRATE; INTEGRATION TECHNOLOGIES; OPTICAL ALIGNMENTS; OPTICAL INTERCONNECT; THERMAL NANOIMPRINT;

OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES;

CHIP SCALE PACKAGES;

EID: 84890039202     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/JLT.2013.2285382     Document Type: Article

References (40)

1. D. Lu, "Recent advances on chip-to-chip optical interconnect," in Proc. Photon. Optoelectron. Meet., 2009, pp. 75160 O-1-75160-14.
2. M. D. W. BOCKSTAELE, "Chip-to-chip parallel optical interconnects over optical backpanels based on arrays of multimode waveguides," in Proc. 9th Annu. Symp. IEEE/LEOS Benelux Chapter, 2004, pp. 61-64.
3. F. E. Doany et al., "Waveguide-coupled parallel optical transceiver technology for Tb/s-class chip-to-chip data transmission," in Integr. Optoelectron. Devices, 2008, pp. 68990 V-1-68990 V-7.
4. C. Kromer et al., "A100-mW4× 10 Gb/s transceiver in 80-nm CMOS for high-density optical interconnects," IEEE J. Solid-State Circuits, vol. 40, pp. 2667-2679, 2005.
5. M.-J. Li et al., "Multicore fiber for optical interconnect applications," in Proc. 17th Opto-Electron. Commun. Conf., 2012, pp. 564-565.
6. G. Van Steenberge et al., "MT-compatible laser-ablated interconnections for optical printed circuit boards," J. Lightw. Technol., vol. 22, pp. 2083-2090, 2004.
7. G. L.Bona et al., "Characterization of parallel optical- interconnectwaveguides integrated on a printed circuit board," in Proc. SPIE, 2004, vol. 5453, pp. 134-141. (Pubitemid 40135322)
8. A. V.Krishnamoorthy, R. Ho,X. Zheng, H. Schwetman, J. Lexau, P.Koka, L. Guoliang, I. Shubin, and J. E. Cunningham, "Computer systems based on silicon photonic interconnects," Proc. IEEE, vol. 97, no. 7, pp. 1337-1361, Jul. 2009.
9. C. Batten, A. Joshi, J. Orcutt, A. Khilo, B. Moss, C. W. Holzwarth, M. A Popovic, L. Hanqing, I. H. Smith, J. L. Hoyt, F. X. Kartner, R. J. Ram, V. Stojanovic, and K. Asanovic, "Building many-core processor-to-DRAM networks with monolithic CMOS silicon photonics," IEEE Micro, vol. 29, no. 4, pp. 8-21, Jul./Aug. 2009.
10. R. T. Chen, L. Lin, C. Choi, Y. J. Liu, B. Bihari, L. Wu, S. Tang, R. Wickman, B. Picor, M. K. Hibb-Brenner, J. Bristow, and Y. S. Liu, "Fully embedded board-level guided-wave optoelectronic interconnects," Proc. IEEE, vol. 88, no. 6, pp. 780-793, Jun. 2000.
11. Y. Liu, L. Lin, C. Choi, B. Bihari, and R. T. Chen, "Optoelectronic integration of polymer waveguide array and metal-semiconductor-metal photodetector through micromirror couplers," IEEE Photon. Technol. Lett., vol. 13, no. 4, pp. 355-357, Apr. 2001. (Pubitemid 32456276)
12. M. Haney et al., "Chip-scale integrated optical interconnects: A key enabler for future high-performance computing," in Proc. SPIE, 2012, vol. 8267, pp. 82670-X-1-82670X-12.
13. R. Nair et al., "Hybrid chip-scale optical interconnects using multiple quantum well devices bonded to silicon," in Proc. IEEE Opt. Interconnects Conf., 2012, pp. 18-19.
14. T. Gu, et al., "Chip-level multiple quantum well modulator-based optical interconnects," J. Lightwave Technol., in press.
15. T. Gu, R. Nair, and M. W. Haney, "Prismatic coupling structure for intrachip global communication," IEEE J. Quantum Electron., vol. 45, no. 4, pp. 388-395, Apr. 2009.
16. D. Liang et al., "Hybrid integrated platforms for silicon photonics," Materials, vol. 3, pp. 1782-1802, 2010.
17. G. Roelkens et al., "Adhesive bonding of InP/InGaAsP dies to processed silicon-on-insulator wafers using DVS-bis-benzocyclobutene," J. Electrochemical Soc., vol. 153, pp. G1015-G1019, 2006. (Pubitemid 44711562)
18. G. Roelkens et al., "III-V/Si photonics by die-to-wafer bonding," Mater. Today, vol. 10, pp. 36-43, 2007. (Pubitemid 46907720)
19. L. Schares, J.A. Kash, F.E. Doany, C.L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, G. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, L. Chao-Kun, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, "Terabus: Terabit/second-class card-level optical interconnect technologies," IEEE J. Sel. Topics Quantum Electron., vol. 12, no. 5, pp. 1032-1044, Sep./Oct. 2006.
20. E. Bosman et al., "Flexible embedded active optical link," Proc. SPIE, vol. 6992, pp. 69920 V-1-69920 V-10, 2008.
21. T. Shibata and A. Takahashi, "Flexible opto-electronic circuit board for indevice interconnection," in Proc. 58th Electron. Compon. Technol. Conf., 2008, pp. 261-267.
22. H. Gan, et al., "Pb-free microjoints (50/spl mu/m pitch) for the next generationmicrosystems: The fabrication, assembly and characterization, " presented at the 56th Electronic Components and Technology Conf., San Diego, CA, USA, 2006, p. 6
23. I. A. Young, E. Mohammed, J. T. S. Liao, A. M. Kern, S. Palermo, B. A. Block, M. R. Reshotko, and P. L. D. Chang, "Optical I/O technology for tera-scale computing," IEEE J. Solid-State Circuits, vol. 45, no. 1, pp. 235-248, Jan. 2010.
24. J. Hofrichter et al., "A low-power high-speed InP microdisk modulator heterogeneously integrated on a SOI waveguide," Opt. Exp., vol. 20, pp. 9363-9370, 2012.
25. D. Ahn et al., "High performance, waveguide integrated Ge photodetectors," Opt. Exp., vol. 15, pp. 3916-3921, 2007. (Pubitemid 46557553)
26. S. J. Madden et al., "Long, low loss etched As2 S3 chalcogenide waveguides for all-optical signal regeneration," Opt. Exp., vol. 15, pp. 14414-14421, 2007. (Pubitemid 350071981)
27. WTD. 2009, 10Gb/s PIN-TIA ROSA PTCM992-405. [Online]. Available: http://www.wtd.com.cn/en/uploadfile/ptcm992-405.pdf
28. M. Lamponi, S. Keyvaninia, C. Jany, F. Poingt, F. Lelarge, G. de Valicourt, G. Roelkens, D. Van Thourhout, S.Messaoudene, J.-M. Fedeli, and G.H. Duan, "Low-threshold heterogeneously integrated InP/SOI lasers with a double adiabatic taper coupler," IEEE Photon. Technol. Lett., vol. 24, no. 1, pp. 76-78, Jan. 2012.
29. JDSU. 2012. JDSU 850 nm 10 G connectorized transmit optical sub-assembly (TOSA). [Online]. Available: http://www.jdsu.com/ProductLiterature/pl-xxd-00- s40-cx-ds-oc-ae.pdf
30. Y. Zou, et al., "High-Performance, High-Index-Contrast Chalcogenide Glass Photonics on Silicon and Unconventional Non-planar Substrates," arXiv:1308.2749. Available: http://arxiv.org/abs/1308.2749).
31. L. Petit et al., "Correlation between physical, optical and structural properties of sulfide glasses in the system Ge-Sb-S," Mater. Chem. Phys., vol. 97, pp. 64-70, 2006. (Pubitemid 43332945)
32. J. J. Hu et al., "Fabrication and testing of planar chalcogenide waveguide integrated microfluidic sensor," Opt. Exp., vol. 15, pp. 2307-2314, Mar. 5, 2007.
33. H. Lin et al., "Demonstration of high-Q mid-infrared chalcogenide glasson-silicon resonators," Opt. Lett., vol. 38, pp. 1470-1472, 2013.
34. L. Li, et al., "3-D integrated flexible glass photonics," arXiv:1307.5937v2. Available: http://arxiv.org/abs/1307.5937v2.
35. J. Hu et al., "Flexible integrated photonics: Where materials, mechanics and optics meet [Invited]," Opt. Mater. Exp., vol. 3, pp. 1313-1331, 2013.
36. J. Lacey and F. Payne, "Radiation loss from planar waveguides with random wall imperfections," IEE Proc. J. Optoelectron., vol. 137, no. 4, pp. 282-288, Aug. 1990. (Pubitemid 20732510)
37. D.-H. Kim et al., "Stretchable and foldable silicon integrated circuits," Science, vol. 320, pp. 507-511, 2008. (Pubitemid 351590659)
38. D.-H. Kim et al., "Materials for stretchable electronics in bioinspired and biointegrated devices," MRS Bull., vol. 37, pp. 226-235, 2012.
39. J. Hu et al., "Planar waveguide-coupled, high-index-contrast, high-Q resonators in chalcogenide glass for sensing," Opt. Lett., vol. 33, pp. 2500-2502, 2008.
40. Y. Zhang et al., "Fabrication of hierarchical pillar arrays from thermoplastic and photosensitive SU-8," Small, vol. 6, pp. 768-775, 2010.