TSV-based 3D integration

Three Dimensional System Integration: IC Stacking Process and Design

Volumn , Issue , 2011, Pages 13-32

  Burns, James ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84889818029     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-0962-6_2     Document Type: Chapter

References (26)

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13. Tezzaron Semiconductor, Naperville, IL 60563, http://www.tezzaron.com/ technology/FaStack.htm
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