Layer transfer of FDSOI CMOS to 150mm InP substrates for mixed-material integration

Conference Proceedings - International Conference on Indium Phosphide and Related Materials

Volumn 2006, Issue , 2006, Pages 226-228

  Warner, K ^a   Oakley, D ^a   Donnelly, J ^a   Keast, C ^a   Shaver, D ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MIXED-MATERIAL INTEGRATION; WAFER BONDING PROCESS;

CMOS INTEGRATED CIRCUITS; DETECTORS; INFRARED IMAGING; INTEGRATED CIRCUIT LAYOUT; METALLORGANIC VAPOR PHASE EPITAXY; THREE DIMENSIONAL COMPUTER GRAPHICS;

SILICON ON INSULATOR TECHNOLOGY;

EID: 33847112810     PISSN: 10928669     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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