Fluxless non-eutectic joints fabricated using gold-tin multilayer composite

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 2, 2003, Pages 416-422

  Lee, Chin C ^a   Chuang, Ricky W ^a  

^a University of California at Irvine   (United States)

Author keywords

Fluxless bonding technique; Gold tin noneutectic alloys; Intermetallics; Multilayer composite; Solders

Indexed keywords

BONDING; CRYSTAL MICROSTRUCTURE; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; GOLD; INTERMETALLICS; MELTING; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; TIN; X RAY MICROSCOPES;

BONDING QUALITY; GOLD TIN MULTILAYER COMPOSITE; NON-EUTECTIC JOINTS;

ELECTRONICS PACKAGING;

EID: 0042887508     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.815109     Document Type: Article

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