Computational modeling of hot-spot identification and control in 3-D stacked chips with integrated cooling

Numerical Heat Transfer; Part A: Applications

Volumn 65, Issue 3, 2014, Pages 201-215

  Alfieri, Fabio ^a   Gianini, Sacha ^a   Tiwari, Manish K ^a   Brunschwiler, Thomas ^b   Michel, Bruno ^b   Poulikakos, Dimos ^a  

^a ETH ZURICH   (Switzerland)

^b IBM RESEARCH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE HEAT TRANSFERS; COMPUTATIONAL MODEL; DIFFERENT SIZES; ELECTRONIC DESIGN; INTEGRATED COOLING; OPTIMAL DESIGN; TEMPERATURE DEPENDENT; THROUGH-SILICON-VIA (TSV);

NUMERICAL ANALYSIS;

REYNOLDS NUMBER;

EID: 84887779162     PISSN: 10407782     EISSN: 15210634     Source Type: Journal    
DOI: 10.1080/10920277.2013.826480     Document Type: Article

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