Comparison of thermal-hydraulic performance of singe-phase micro-pin-fin and micro-channel heat sinks

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 105-112

  Qu, Weilin ^a  

^a University of Hawaii at Manoa   (United States)

Author keywords

Micro channel heat sinks; Micro pin fin heat sinks; Pressure loss; Single phase; Thermal resistance

Indexed keywords

COPPER; ELASTIC MODULI; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FINS (HEAT EXCHANGE); FLUID MECHANICS; FORMING; FUSION REACTIONS; HYDRAULICS; NUCLEAR PHYSICS; THERMOMECHANICAL TREATMENT;

MICRO-CHANNEL HEAT SINKS; MICRO-PIN-FIN HEAT SINKS; PRESSURE LOSS; SINGLE-PHASE; THERMAL RESISTANCE;

HEAT SINKS;

EID: 50949100647     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544260     Document Type: Conference Paper

References (14)

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