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1
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H. Kohlstedt, Y. Mustafa, A. Gerber, A. Petrau, M. Fitssilis, R. Meyer, R. Waser, U. Böttger, and R. Waser, Microel. Engineer., 80, 296 (2005).
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Waser, R.7
Böttger, U.8
Waser, R.9
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3
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80052804532
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T.S. Böscke, J. Müller, D. Bräuhaus, U. Schröder, and U. Böttger, Appl. Phys. Lett, 99, 102903 (2011).
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Appl. Phys. Lett
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Böscke, T.S.1
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4
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80053211514
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J. Mueller, T. S. Boescke, D. Braeuhaus, U. Schroeder, U. Boettger, J. Sundqvist, P. Kuecher, T. Mikolajick, and L. Frey, Appl. Phys. Lett, 99, 112901 (2011).
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Appl. Phys. Lett
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Mueller, J.1
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Boettger, U.5
Sundqvist, J.6
Kuecher, P.7
Mikolajick, T.8
Frey, L.9
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5
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84864679411
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J. Müller, T. Böscke, U. Schröder, S. Mueller, D. Bräuhaus, U. Böttger, L. Frey, and T. Mikolajick, Nano Lett, 12(8), 4318 (2012).
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(2012)
Nano Lett
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Müller, J.1
Böscke, T.2
Schröder, U.3
Mueller, S.4
Bräuhaus, D.5
Böttger, U.6
Frey, L.7
Mikolajick, T.8
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6
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84861799687
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S. Müller, J. Müller, A. Singh, S. Riedel, J. Sundqvist, U. Schroeder, and T. Mikolajick, Adv. Funct. Mat., 22, 2412 (2012).
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(2012)
Adv. Funct. Mat.
, vol.22
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Müller, S.1
Müller, J.2
Singh, A.3
Riedel, S.4
Sundqvist, J.5
Schroeder, U.6
Mikolajick, T.7
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7
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80053193219
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T.S. Böscke, J. Müller, D. Bräuhaus, U. Schröder, and U. Böttger, Appl. Phys. Lett., 99 112904 (2011).
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Appl. Phys. Lett.
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Böscke, T.S.1
Müller, J.2
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Schröder, U.4
Böttger, U.5
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8
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84887445256
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S. Müller, C. Adelmann, A. Singh, S. Van Elshocht, U. Schröder, and T. Mikolajick, ECS J. Solid State Sci. Technol., 1(6), N123 (2012).
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(2012)
ECS J. Solid State Sci. Technol.
, vol.1
, Issue.6
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Müller, S.1
Adelmann, C.2
Singh, A.3
Van Elshocht, S.4
Schröder, U.5
Mikolajick, T.6
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9
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84857705566
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J. Müller, U. Schröder, T.S. Böscke, I. Müller, U. Böttger, L. Wilde, J. Sundqvist, M. Lemberger, P. Kücher, T. Mikolajick, and L. Frey, JAP, 110, 114113 (2011).
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(2011)
JAP
, vol.110
, pp. 114113
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Müller, J.1
Schröder, U.2
Böscke, T.S.3
Müller, I.4
Böttger, U.5
Wilde, L.6
Sundqvist, J.7
Lemberger, M.8
Kücher, P.9
Mikolajick, T.10
Frey, L.11
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10
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0011934453
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E. Yurchuk, J. Müller, S. Knebel, J. Sundqvist, A. Graham, T. Melde, U. Schroeder, and T. Mikolajick, Thin Solid Films, 2012.
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(2012)
Thin Solid Films
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Yurchuk, E.1
Müller, J.2
Knebel, S.3
Sundqvist, J.4
Graham, A.5
Melde, T.6
Schroeder, U.7
Mikolajick, T.8
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11
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0000562043
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M. Yashima, H. Takahashi, K. Ohtake, T. Hirose, M. Kakihana, H. Arashi, Y. Ikuma, Y. Suzuki, and M. Yoshimura, J. Phys. Chem. Solids, 57, 289 (1996)
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J. Phys. Chem. Solids
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Yashima, M.1
Takahashi, H.2
Ohtake, K.3
Hirose, T.4
Kakihana, M.5
Arashi, H.6
Ikuma, Y.7
Suzuki, Y.8
Yoshimura, M.9
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12
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0000339154
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H. Fujimori, M. Yashima, S. Sasaki, M. Kakihana, T. Mori, M. Tanaka, and M. Yoshimura, Chem. Phys. Lett., 346, 217 (2001).
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Chem. Phys. Lett.
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Fujimori, H.1
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Tanaka, M.6
Yoshimura, M.7
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13
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33749476389
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K. Tomida, K. Kita, and A. Toriumi, Appl. Phys. Lett., 89, 142902 (2006).
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Appl. Phys. Lett.
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Tomida, K.1
Kita, K.2
Toriumi, A.3
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14
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84856294639
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J. Müller, T. Böscke, U. Schröder, R. Hoffmann, T. Mikolajick, and L. Frey, Electr. Device Letter, 33, 185 (2012).
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(2012)
Electr. Device Letter
, vol.33
, pp. 185
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Müller, J.1
Böscke, T.2
Schröder, U.3
Hoffmann, R.4
Mikolajick, T.5
Frey, L.6
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15
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84865431003
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S. Mueller, S. Summerfelt, J. Müller, U. Schroeder, and T. Mikolajick, Electr. Device Letter, 33, 1300 (2012).
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(2012)
Electr. Device Letter
, vol.33
, pp. 1300
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Mueller, S.1
Summerfelt, S.2
Müller, J.3
Schroeder, U.4
Mikolajick, T.5
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17
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84887485260
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Cambridge, UK
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W. Weinreich, R. Reiche, M. Lemberger, G. Jegert, J. Müller, L. Wilde, A. Shariq, S. Teichert, J. Heitmann, E. Erben, L. Oberbeck, U. Schröder, A. J. Bauer, and H. Ryssel, 16th Conference of Insulating Films on Semiconductors 2009, Cambridge, UK.
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16th Conference of Insulating Films on Semiconductors 2009
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Weinreich, W.1
Reiche, R.2
Lemberger, M.3
Jegert, G.4
Müller, J.5
Wilde, L.6
Shariq, A.7
Teichert, S.8
Heitmann, J.9
Erben, E.10
Oberbeck, L.11
Schröder, U.12
Bauer, A.J.13
Ryssel, H.14
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18
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36148989156
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C. Fachmann, L. Frey, S. Kudelka, T. Boescke, S. Nawka, E. Erben, and T. Doll, Mcrtrnc Engnrng 84(12), 2883(2007)
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Mcrtrnc Engnrng
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, Issue.12
, pp. 2883
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Fachmann, C.1
Frey, L.2
Kudelka, S.3
Boescke, T.4
Nawka, S.5
Erben, E.6
Doll, T.7
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19
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84885797226
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D. Martin, E. Yurchuk, S. Müller, J. Müller, J. Paul, J. Sundquist, S. Slesazeck, T. Schloesser, R. van Bentum, M. Trentzsch, U. Schroeder, and T. Mikolajick, Proc. Ultimate Integration on Silicon 2012 (2012).
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(2012)
Proc. Ultimate Integration on Silicon 2012
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Martin, D.1
Yurchuk, E.2
Müller, S.3
Müller, J.4
Paul, J.5
Sundquist, J.6
Slesazeck, S.7
Schloesser, T.8
Van Bentum, R.9
Trentzsch, M.10
Schroeder, U.11
Mikolajick, T.12
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20
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84887446796
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Honolulu, USA
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J. Müller, E. Yurchuk, T. Schlösser, J. Paul, R. Hoffmann, S. Müller, D. Martin, S. Slesazeck, P. Polakowski, J. Sundqvist, M. Czernohorsky, K. Seidel, P. Kücher, R. Boschke, M. Trentzsch, K. Gebauer, U. Schröder, and T. Mikolajick, Proceeding of IEEE Symposia on VLSI Technology and Circuits, Honolulu, USA, 2012.
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(2012)
Proceeding of IEEE Symposia on VLSI Technology and Circuits
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Müller, J.1
Yurchuk, E.2
Schlösser, T.3
Paul, J.4
Hoffmann, R.5
Müller, S.6
Martin, D.7
Slesazeck, S.8
Polakowski, P.9
Sundqvist, J.10
Czernohorsky, M.11
Seidel, K.12
Kücher, P.13
Boschke, R.14
Trentzsch, M.15
Gebauer, K.16
Schröder, U.17
Mikolajick, T.18
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21
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84887425180
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May 20th-23rd 2012, Milano, Italy
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E. Yurchuk, J. Müller, R. Hoffmann, J. Paul, D. Martin, R. Boschke, T. Schlösser, S. Müller, S. Slesazeck, R. van Bentum, M. Trentzsch, U. Schröder, and T. Mikolajick, 4th International Memory Workshop, May 20th-23rd 2012, Milano, Italy.
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4th International Memory Workshop
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Yurchuk, E.1
Müller, J.2
Hoffmann, R.3
Paul, J.4
Martin, D.5
Boschke, R.6
Schlösser, T.7
Müller, S.8
Slesazeck, S.9
Van Bentum, R.10
Trentzsch, M.11
Schröder, U.12
Mikolajick, T.13
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