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Volumn , Issue , 2011, Pages 3-37

Surface and Colloidal Chemical Aspects of Wet Cleaning

Author keywords

Electrical double layer; High aspect ratio cleaning; Interfacial phenomena; Metal adsorption; Surface charging of metal oxide and nitride; Surface tension gradient drying; Wet cleaning

Indexed keywords


EID: 84885972230     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9781118071748.ch1     Document Type: Chapter
Times cited : (1)

References (88)
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    • Chapter 3, Second Edition, (Reinhardt, K. A. and Kern, W., eds.) William Andrew Publishing, New York
    • Busnaina, A., Park, J., and Bakhtari, K., Chapter 3, Handbook of Silicon Wafer Cleaning Technology, Second Edition, (Reinhardt, K. A. and Kern, W., eds.) William Andrew Publishing, New York, (2007).
    • (2007) Handbook of Silicon Wafer Cleaning Technology
    • Busnaina, A.1    Park, J.2    Bakhtari, K.3
  • 8
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    • Hunter, R. J., Introduction to Modern Colloid Science, Oxford University Press, Oxford, United Kingdom (1994). 36 HANDBOOK OF CLEANING FOR SEMICONDUCTOR MANUFACTURING
    • (1994) Introduction to Modern Colloid Science
    • Hunter, R.J.1
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    • Chapter 1 (Gould, R. E, ed.) American Chemical Society, Washington D.C.
    • Zisman, W. A., Contact Angle, Wettability, and Adhesion, Chapter 1 (Gould, R. E, ed.) American Chemical Society, Washington D.C., (1964).
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    • Zisman, W.A.1
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    • Rideal, E. K., Phil. Mag., 44(264):1152 (1922).
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.