Marangoni wafer drying avoids disadvantages

Solid State Technology

Volumn 39, Issue 8, 1996, Pages 87-90

  Wolke, Klaus ^a,b,c   Eitel, Bärbel ^a   Schenkl, Manfred ^a,d   Rümmelin, Stefan ^a,e,f   Schild, Robin ^a,b  

^a STEAG MicroTech ^*  (Germany)

^b UNIVERSITY OF MÜNSTER   (Germany)

^c STEAG AG   (Germany)

^d UNIVERSITY OF TÜBINGEN   (Germany)

^e UNIVERSITY OF STUTTGART   (Germany)

^f IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CONTAMINATION; DRYING; SILICON WAFERS;

MARANGONI WAFER DRYING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0030201607     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. K. Locke, 'Marangoni Dryer Evaluation, 'STEAG report, p. 1 (1986).
2. R. Schid, K. Locke, M. Kozak, M. Heyns, 'Marangoni drying: a new concept for drying silicon wafers,' Proceedings of 2nd Int. Symp. UCPSS, Bruges, Belgium (1994).
3. L. Li, et al., 'improvements and evaluation of drying techniques for HF last water cleaning,' Proceedings of 2nd Int. Symp. UCPSS, Bruges, Belgium (1994).