Liquid-phase processing of hydrophilic features on a silicon wafer

Journal of the Electrochemical Society

Volumn 144, Issue 12, 1997, Pages 4331-4335

  Olim, Moshe ^a  

^a FSI International   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); PARTICLES (PARTICULATE MATTER); SILICA; SURFACE TENSION; WATER; WETTING;

FEATURE WETTING; HYDROPHILIC FEATURE; LIQUID PHASE PROCESSING;

SILICON WAFERS;

EID: 0031380824     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838187     Document Type: Article

References (7)

1. Handbook of Semiconductor Cleaning Technology, W. Kern, Editors, Noyes Publications, Park Ridge, NJ (1993).
2. J. Parker, S. Verhaberke, and C. McConnel, Abstract 503, p. 800, The Electrochemical Society Meeting Abstracts, Vol. 95-2, Chicago, IL, Oct. 8-13, 1995.
3. A. W. Anderson, Physical Chemistry of Surfaces, 4th ed., John Wiley & Sons, Inc., New York (1982).
4. J. H. Noggle, Physical Chemistry, Little, Brown and Co., New York (1985).
5. I. Nakao, H. Umimoto, S. Onodaka, T. Ohzone, and H. Esaki, This Journal, 137, 2303 (1990).
6. J. S. Kirkaldy and D. J. Young, Diffusion in the Condensed State., The Institute of Metals, London (1987).
7. R. B. Bird, W. E. Stewart, and E. N. Lightfoot, Transport Phenomena, John Wiley & Sons, New York (1960).