Carbon nanotubes in electronics interconnect applications with a focus on 3D-TSV technology

ECS Transactions

Volumn 44, Issue 1, 2012, Pages 683-692

  Jiang, Di ^a   Wang, Teng ^a   Ye, Lilei ^b   Jeppson, Kjell ^a   Liu, Johan ^a,c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHT SMART HIGH TECH AB   (Sweden)

^c Shanghai University Campus   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBES; CHIP SCALE PACKAGES; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATION; SEMICONDUCTOR DEVICE MANUFACTURE;

ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICAL INTERCONNECTS; ELECTRONICS INTEGRATIONS; INTEGRATED ELECTRONICS; INTEGRATION TECHNOLOGIES; INTERCONNECT APPLICATIONS; THREE DIMENSIONAL (3D) INTEGRATION; THROUGH-SILICON-VIA (TSV);

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84885600672     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3694387     Document Type: Conference Paper

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