A clamped through silicon via (TSV) interconnection for stacked chip bonding using metal cap on pad and metal column forming in via

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 544-549

  Shen, Li Cheng ^a   Chien, Wei Chien ^a   Jaung, Jin Ye ^a   Hung, Yin Po ^a   Lo, Wei Chung ^a   Hsu, Chao Kai ^a   Lee, Yuan Chang ^a   Cheng, Hsien Chie ^b   Lin, Chia Te ^b  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPUTER NETWORKS; METAL FORMING; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON WAFERS;

CHIP BONDING; METAL CAPPING; THROUGH SILICON VIA;

WAFER BONDING;

EID: 51349135169     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550026     Document Type: Conference Paper

References (10)

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