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Journal of Materials Chemistry C

Volumn 1, Issue 42, 2013, Pages 7111-7116

Base-etch removal of a ligand shell in thin films of ZnO nanoparticles for electronic applications

(6) Weber, Dennis a,b Sharma, Richa b,c Botnaraş, Silviu b Pham, Duy Vu b Steiger, Jürgen b De Cola, Luisa d

a UNIVERSITY OF MÜNSTER (Germany)

b EVONIK INDUSTRIES AG (Germany)

c JACOBS UNIVERSITY BREMEN (Germany)

d UNIVERSITÉ DE STRASBOURG (France)

Author keywords

[No Author keywords available]

Indexed keywords

DECOMPOSITION; LIGANDS; METAL NANOPARTICLES; SEMICONDUCTOR DEVICE MANUFACTURE;

ALTERNATIVE PROCEDURES; ANNEALING TEMPERATURES; ELECTRONIC APPLICATION; FIELD-EFFECT MOBILITIES; FUNCTIONALIZED NANOPARTICLES; SEMICONDUCTIVE PROPERTIES; SEMICONDUCTOR INDUSTRY; THIN-FILM TRANSISTOR (TFTS);

ELECTRIC PROPERTIES;

EID: 84885449876 PISSN: 20507534 EISSN: 20507526 Source Type: Journal
DOI: 10.1039/c3tc31059k Document Type: Article

Times cited : (7)

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