Mechanism of co liner as enhancement layer for Cu interconnect gap-fill

Journal of the Electrochemical Society

Volumn 160, Issue 12, 2013, Pages

  He, M ^a   Zhang, X ^a   Nogami, T ^b   Lin, X ^a   Kelly, J ^b   Kim, H ^a   Spooner, T ^b   Edelstein, D ^b   Zhao, L ^a  

^a IBM MICROELECTRONICS   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CU INTERCONNECT; ELECTROCHEMICAL PLATING PROCESS; ENHANCEMENT LAYERS; INTERCONNECT STRUCTURES; REFLOW PROCESS; RESPUTTERING PROCESS; SEED PROCESS; STICKING COEFFICIENTS;

ELECTROCHEMISTRY;

ELECTROCHEMICAL PROPERTIES;

EID: 84884324514     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/2.009312jes     Document Type: Article

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