Conformal CVD Co deposition for enhancement of Cu gapfill application

Advanced Metallization Conference (AMC)

Volumn , Issue , 2009, Pages 155-160

  Lu, Jiang ^a   Ha, Hyoung Chan ^a   AuBuChon, Joseph ^a   Ma, Paul ^a   Tseng, Jennifer M ^a   Yu, Sang Ho ^a   Narasimhan, Murali ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER LAYERS; CO DEPOSITION; CU-INTERCONNECT TECHNOLOGY; CU-INTERCONNECTS; ENHANCEMENT LAYERS; PHYSICAL VAPOR DEPOSITED; SEED ENHANCEMENT; SEED LAYER; SMALL GEOMETRY; TRENCH/VIA;

COBALT; COPPER; METALLIZING; OPTICAL INTERCONNECTS; TANTALUM; VAPORS;

CHEMICAL VAPOR DEPOSITION;

EID: 70349941071     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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