Bendable ultra-thin silicon chips on foil

Proceedings of IEEE Sensors

Volumn , Issue , 2012, Pages

  Dahiya, Ravinder S ^a   Adami, Andrea ^a   Collini, Cristian ^a   Lorenzelli, Leandro ^a  

^a FONDAZIONE BRUNO KESSLER   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

1-D STRUCTURES; FLEXIBLE SUBSTRATE; LARGE-SIZED; PASSIVE DEVICES; POST PROCESSING; RADIUS OF CURVATURE; TESTING RANGE; TRANSFER PRINTING; ULTRA-THIN; ULTRATHIN SILICON;

POLYIMIDES; SENSORS;

SILICON;

EID: 84873974824     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2012.6411514     Document Type: Conference Paper

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