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Ultra-thin Chip Technology and Applications
Volumn , Issue , 2011, Pages 21-32
Thin wafer manufacturing and handling using low cost carriers
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EID: 84884143175     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-7276-7_3     Document Type: Chapter
Times cited : (5)
References (3)
  • 1
    • 0037302645 scopus 로고    scopus 로고
    • Fracture strength characterization and analysis of silicon dies
    • Wu JD, Huang CY, Liao CC (2003) Fracture strength characterization and analysis of silicon dies. Microelectron Reliab 43:269-277
    • (2003) Microelectron Reliab , vol.43 , pp. 269-277
    • Wu, J.D.1    Huang, C.Y.2    Liao, C.C.3
  • 2
    • 84892056078 scopus 로고    scopus 로고
    • distributions are plotted corresponding to
    • Weibull distributions are plotted corresponding to: http://www.weibull. de/WeibullHTML.htm
  • 3
    • 84892069952 scopus 로고    scopus 로고
    • Five-side stress relief: The method to get the "perfect die", advanced packaging conference 10-11 October 2007
    • Stuttgart, Germany
    • Heinze PM, Amberger M and Chabert T (2007) Five-side stress relief: the method to get the "perfect die", advanced packaging conference 10-11 October 2007, SEMICON Europa 2007, Stuttgart, Germany
    • (2007) SEMICON Europa 2007
    • Heinze, P.M.1    Amberger, M.2    Chabert, T.3

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.