Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bonding

Science and Technology of Welding and Joining

Volumn 18, Issue 5, 2013, Pages 421-424

  Li, C C ^a   Zhu, Z X ^a   Liao, L L ^b   Dai, M J ^b   Liu, C K ^b   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Intermetallic compounds; Solder; Thermal stability; Thermoelectric

Indexed keywords

ALUMINA SUBSTRATES; BONDING TECHNIQUES; LOW TEMPERATURE BONDING; MICRO-STRUCTURE EVOLUTIONS; TEMPERATURE APPLICATIONS; THERMO-ELECTRIC MATERIALS; THERMO-ELECTRIC MODULES; THERMOELECTRIC;

ALUMINA; INTERMETALLICS; MICROSTRUCTURE; SOLDERING; SOLDERING ALLOYS; TEMPERATURE; THERMODYNAMIC STABILITY; THERMOELECTRICITY;

BONDING;

EID: 84882639204     PISSN: 13621718     EISSN: 17432936     Source Type: Journal    
DOI: 10.1179/1362171813Y.0000000116     Document Type: Article

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