Effect of interfacial compound formation on contact resistivity of soldered junctions between bismuth telluride-based thermoelements and copper

Electrochemical and Solid-State Letters

Volumn 10, Issue 9, 2007, Pages 23-25

  Liao, Chien Neng ^a,b   Lee, Ching Hua ^a   Chen, Wen Jin ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b ELECTROCHEMICAL SOCIETY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH TELLURIDE; INTERFACIAL COMPOUND FORMATION; THERMOELECTRIC COOLERS;

BISMUTH COMPOUNDS; CONTACT RESISTANCE; COPPER COMPOUNDS; SOLDERED JOINTS; SOLDERING ALLOYS;

SEMICONDUCTOR JUNCTIONS;

EID: 34547187556     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2749330     Document Type: Article

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