Interfacial evolution behavior and reliability evaluation of CoSb3/Ti/Mo-Cu thermoelectric joints during accelerated thermal aging

Journal of Alloys and Compounds

Volumn 477, Issue 1-2, 2009, Pages 425-431

  Zhao, Degang ^a,b   Li, Xiaoya ^a   He, Lin ^c   Jiang, Wan ^a   Chen, Lidong ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c NONE   (China)

Author keywords

Accelerated thermal aging; CoSb3 based device; Interfacial reaction; Thermoelectric

Indexed keywords

ACCELERATED THERMAL AGING; AGING TIME; COSB3-BASED DEVICE; EDS ANALYSIS; EVOLUTION BEHAVIORS; IMC LAYERS; INTERFACIAL REACTION; INTERFACIAL STRUCTURES; INTERMETALLIC COMPOUNDS; RELIABILITY EVALUATIONS; SEM; SQUARE ROOTS; THERMOELECTRIC; THREE LAYERS;

GROWTH KINETICS; RELIABILITY; SHEAR STRENGTH; THERMAL AGING; TITANIUM;

SEMICONDUCTING INTERMETALLICS;

EID: 67349109762     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.10.037     Document Type: Article

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