Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium

Journal of Materials Research

Volumn 25, Issue 2, 2010, Pages 391-395

  Liao, Chien Neng ^a   Huang, Yen Chun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AG ADDITIONS; BI-LAYER; MEAN PARTICLE SIZE; MECHANICAL AND ELECTRICAL PROPERTIES; MOLTEN SOLDERS; REACTION TIME; SN-3.5AG SOLDERS; THERMOELECTRIC MODULES;

BISMUTH; BISMUTH COMPOUNDS; ELECTRIC PROPERTIES; GROWTH KINETICS; MECHANICAL PROPERTIES; REACTION KINETICS; SILVER; TELLURIUM; TELLURIUM COMPOUNDS; THERMOELECTRICITY;

TIN;

EID: 77957965005     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2010.0040     Document Type: Conference Paper

References (12)

1. C.N. Liao, C.H. Lee, and W.J. Chen: Effect of interfacial compound formation on electrical properties of solder-jointed bismuth telluride/copper junctions. Electrochem. Solid-State Lett. 10, 23 (2007).
2. M.L. Huang, T. Loeher, A. Ostmann, and H. Reichi: Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders. Appl. Phys. Lett. 86, 181908 (2005).
3. S.C. Hsu, S.J. Wang, and C.Y. Liu: Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization. J. Electron. Mater. 32, 1214 (2003).
4. 0.3) crystals and some alloys. Inorg. Mater. 31, 178 (1995).
5. S.W. Chen and C.N. Chiu: Unusual cruciform pattern interfacial reactions in Sn/Te couples. Scr. Mater. 56, 97 (2007).
6. C.N. Liao and G.H. Lee: Suppression of vigorous liquid Sn/Te reactions by Sn-Cu solder alloys. J. Mater. Res. 23, 3303 (2008).
7. I. Karakaya and W.T. Thompson: The Ag-Te (silver-tellurium) system. J. Phase Equilib. 12, 56 (1991).
8. I. Barin and G. Platzki: Thermochemical Data of Pure Substances (Wiley-VCH, New York, 1995), p. 1556.
9. H.K. Kim, H.K. Liou, and K.N. Tu: Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu. Appl. Phys. Lett. 66, 2337 (1995).
10. H.K. Kim and K.N. Tu: Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. Phys. Rev. B 53, 16027 (1996).
11. K.N. Tu, J.W. Mayer, and L.C. Feldman: Electronic Thin Film Science for Electrical Engineers and Materials Scientists (Macmillan, New York, 1992), p. 100.
12. R.W. Balluffi, S.M. Allen, and W.C. Carter: Kinetics of Materials (Wiley, Hoboken, NJ, 2005), Chap. 15.