Bumpless through-dielectrics-silicon-via (TDSV) technology for wafer-based three-dimensional integration (3DI)

ECS Transactions

Volumn 44, Issue 1, 2012, Pages 827-840

  Ohba, Takayuki ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; SEMICONDUCTOR DEVICE MANUFACTURE; THREE DIMENSIONAL INTEGRATED CIRCUITS;

DUAL DAMASCENE INTERCONNECTS; ON-WAFER; SILICON VIA; THREE DIMENSIONAL INTEGRATION;

SILICON WAFERS;

EID: 84880863181     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3694403     Document Type: Conference Paper

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