Impact of thermomechanical stresses on bumpless chip in stacked wafer structure

Japanese Journal of Applied Physics

Volumn 52, Issue 5 PART 4, 2013, Pages

  Mizushima, Yoriko ^a,b   Kitada, Hideki ^a,b   Uchibori, Chihiro J ^a   Maeda, Nobuhide ^b   Kodama, Shoichi ^b   Kim, Youngsuk ^b   Fujimoto, Koji ^b   Yoshimi, Seiichi ^b   Nakamura, Tomoji ^a   Ohba, Takayuki ^b  

^a FUJITSU LABORATORIES LTD   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BENZOCYCLOBUTENE; CRACK DRIVING FORCE; DIELECTRIC POLYMERS; HYBRID STRUCTURE; POLYMER THICKNESS; STRESS SIMULATIONS; THERMO-MECHANICAL STRESS; WAFER STRUCTURE;

CRACKS; POLYMERS; RESINS; SILICON; THERMAL STRESS;

SILICON WAFERS;

EID: 84880859261     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.7567/JJAP.52.05FE01     Document Type: Conference Paper

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