Investigation of interconnect design on chip package interaction and mechanical reliability of Cu/low-k multi-layer interconnects in flip chip package

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 150-152

  Uchibori, Chihiro J ^a   Zhang, Xuefeng ^b   Ho, Paul S ^b   Nakamura, Tomoji ^b  

^a FUJITSU LABORATORIES OF AMERICA   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; CRACK PROPAGATION; DIELECTRIC MATERIALS; FLOW INTERACTIONS; RELIABILITY ANALYSIS;

INTERCONNECT DESIGN; MECHANICAL RELIABILITY; METAL LAYERS;

RELIABILITY;

EID: 50949083158     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546952     Document Type: Conference Paper

References (12)

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