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Volumn 84, Issue , 2013, Pages 185-190

A manufacturable process integration approach for graphene devices

Author keywords

Dielectric breakdown; Graphene; Hot electrons; Process integration; Quantum capacitance; Transistors

Indexed keywords

ATOMIC LAYER DEPOSITION; CAPACITANCE; DIELECTRIC MATERIALS; ELECTRIC BREAKDOWN; ELECTRIC FIELDS; FIELD EFFECT TRANSISTORS; GATE DIELECTRICS; GRAPHENE DEVICES; GRAPHENE TRANSISTORS; HOT ELECTRONS; LEAKAGE CURRENTS; MICROELECTRONICS; MOS DEVICES; SILICON OXIDES; SILICON WAFERS; TRANSISTORS; WSI CIRCUITS;

EID: 84879505639     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sse.2013.02.008     Document Type: Article
Times cited : (25)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.