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Volumn 54, Issue 6, 2013, Pages 879-883
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Metal-metal bonding process using Cu+Ag mixed nanoparticles
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Author keywords
Bonding; Copper+silver mixed nanoparticles; Electronics packaging; Sintering
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Indexed keywords
AG NANOPARTICLE;
BONDING TEMPERATURES;
CHEMICAL REDUCTION METHODS;
CU NANO-PARTICLES;
METAL-METAL BONDING;
MIXED NANOPARTICLES;
BONDING;
CHEMICAL BONDS;
ELECTRONICS PACKAGING;
METAL NANOPARTICLES;
SINTERING;
SILVER;
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EID: 84878923280
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.MD201222 Document Type: Conference Paper |
Times cited : (30)
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References (15)
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