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Volumn 54, Issue 6, 2013, Pages 879-883

Metal-metal bonding process using Cu+Ag mixed nanoparticles

Author keywords

Bonding; Copper+silver mixed nanoparticles; Electronics packaging; Sintering

Indexed keywords

AG NANOPARTICLE; BONDING TEMPERATURES; CHEMICAL REDUCTION METHODS; CU NANO-PARTICLES; METAL-METAL BONDING; MIXED NANOPARTICLES;

EID: 84878923280     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MD201222     Document Type: Conference Paper
Times cited : (30)

References (15)
  • 5
    • 84902569661 scopus 로고    scopus 로고
    • (ed.):, (Cambridge, UK: CRC/Woodhead)
    • Y. Zhou (ed.): Microjoining and Nanojoining, (Cambridge, 464 UK: CRC/Woodhead, 2008).
    • (2008) Microjoining and Nanojoining , pp. 464
    • Zhou, Y.1
  • 13
    • 0037073941 scopus 로고    scopus 로고
    • Y. Sun and Y. Xia: Science 298 (2002) 2176-2179.
    • (2002) Science , vol.298 , pp. 2176-2179
    • Sun, Y.1    Xia, Y.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.