Layer structure and thickness effects on electroplated AuSn solder bump composition

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 604-609

  Bonafede, Salvatore ^a   Huffman, Alan ^b   Palmer, W Devereux ^c  

^a Nextreme Thermal Solutions   (United States)

^b RTI INTERNATIONAL   (United States)

^c U S ARMY RESEARCH OFFICE   (United States)

Author keywords

Electrochemical processes; Fabrication; Gold alloys; Lead free solder; Tin alloys

Indexed keywords

ELECTRONICS PACKAGING; ELECTROPLATING; EUTECTICS; GOLD ALLOYS; LEAD COMPOUNDS; MECHANICAL PROPERTIES; STRUCTURE (COMPOSITION);

ELECTROCHEMICAL PROCESSES; LEAD-FREE SOLDER;

SOLDERING ALLOYS;

EID: 33748557788     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.880506     Document Type: Article

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