Interfacial reactions between Sn-57Bi-1Ag solder and electroless Ni-P/immersion Au under solid-state aging

Journal of Materials Science

Volumn 47, Issue 9, 2012, Pages 4036-4041

  Fuchs, Christopher ^a   Schreck, Timo ^a   Kaloudis, Michael ^a  

^a UNIVERSITY OF APPLIED SCIENCES ASCHAFFENBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; ELECTROLESS NI-P; ENERGY DISPERSIVE X-RAY SPECTROSCOPY; GROWTH CONSTANTS; ISOTHERMAL AGING; KIRKENDALL VOID; LONG-TERM AGING; SOLID-STATE AGING; SQUARE ROOTS;

ACTIVATION ENERGY; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS;

TIN;

EID: 84857645589     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-012-6257-x     Document Type: Article

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