Case study for high volume lead-free wave soldering process with environmental benefits

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2005, Pages 102-106

  Baylakoglu, Ilknur ^a,b   Hamarat, Seref ^b,c   Gokmen, Haluk ^b,d,e   Meric, Esra ^b,f  

^a MATERIALS INSTITUTE   (Turkey)

^b VESTEL Electronics ^*  (Turkey)

^c Turkish Importers Association   (Turkey)

^d VESTEL ELECTRONICS   (Turkey)

^e Vestel   (Turkey)

^f Vestel Electronics R and D Center RoHS   (Turkey)

Author keywords

[No Author keywords available]

Indexed keywords

DROSS FORMATION; LEAD-FREE SOLDERS; SPENT SOLDERS; WAVE SOLDERING;

ENVIRONMENTAL IMPACT; ENVIRONMENTAL PROTECTION; IMPURITIES; LEAD; NITROGEN; TERNARY SYSTEMS; WETTING;

SOLDERING;

EID: 28744439059     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. Theriault, M., Blostein, P. and Dr. A. Rahn, "Nitrogen and Soldering: Reviewing the Issue of Inerting", Surface Mount Technology (SMT), June 2000.
2. Zachariassen, K., Ausen, D., Turtola, A., Lahti, M., and Andersson, D. "NoNE (No Lead in Nordic Electronics) lead-free soldering guideline-Version 2", SINTEF Report: STF90 A04620, November 2004.
3. www.airliauide.com. Feb. 2005.
4. Arra, M., Shangguan, D., Yi, S., Thalhammer, R., and Fockenberger, H. "Development of Lead-Free Wave Soldering Process", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25, No. 4, October 2002.
5. Puttlitz, K., and Stalter, S. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, New York, USA, Marcel Dekker Inc., 2004, pp.569-590.
6. Sunappan, V., and Collier, P., "Lead-free Wave Soldering Development for PCS Assembly", IEEE Electronic Components and Technology Conference, 2003.
7. Pecht, M. and Oanesan, S., Lead-free Electronics, Maryland, USA, CALCE EPSC, 2004, pp.210-223.
8. Suganuma, K. Lead-Free Soldering in Electronics, Marcel Dekker Inc., 2004, pp. 271-285.
9. Oyemant, T., "Lead-free Wave Soldering: A Cost-effective Alternative", Surface Mount Technology (SMT), December 2003.
10. J Lau, J.H., Wong, C.P., Lee, N., and Lee, R., Electronics Manufacturing with Lead-free, Halogen-free, and Conductive-adhesive Materials, New York, USA, McGraw-Hill Inc., 2003, pp.16.13-16.20.
11. nd Int.Symp. Environmentally Conscious Design Inverse Manufact., Los Alamitos, CA, Dec. 2001, pp.1131-1136.
12. Hwang J.S., Environment-Friendly Electronics: Lead-free Technology, Bristol, ENGLAND, Electrochemical Publications Ltd., 2001, pp.725-729.