Effects of atmosphere composition on soldering performance of lead-free alternatives

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 1, Issue , 1997, Pages 211-221

  Dong, C Christine ^a   Schwarz, Alexander ^a   Roth, Dean V ^a  

^a AIR PRODUCTS AND CHEMICALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD FREE SOLDERS; SOLDERING PERFORMANCE;

COMPOSITION EFFECTS; DISSOLUTION; IMPURITIES; OXIDATION; REDUCTION; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 0030719089     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)