Nitrogen and soldering reviewing the issue of inerting

SMT Surface Mount Technology Magazine

Volumn 14, Issue 6, 2000, Pages 52-58

  Theriault, M ^a   Blostein, P ^a   Rahn, A ^a  

^a AIR LIQUIDE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33745571295     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. M. Theriault and P. Blostein, Reducing the Cost of Inert Soldering, Circuits Assembly, July 1998, p. 46-52.
2. C.C. Dong, et al., Effects of Atmosphere Composition on Soldering Performance of Lead-free Alternatives, NEPCON West 1997.
3. S.M.Adams, E.K. Chang and M.). Kirschner, Atmospheres and Performance During Soldering, NEPCON West 1994.
4. C.C. Dong, et al., Oxygen Concentration in the Soldering Atmosphère -How Low Must We Co? NEPCON West 1996.
5. C. Lee, The Significance of Oxygen Concentration in the Atmosphere, Circuit World, No. 18,1992.
6. J. Greaves, et al., An Evaluation of Alternative Surface Finishes by the Circuit Card Assembly and Materials Task Force, NEPCON West 1997.
7. D. Verbockhaven and G. Conor, OSP Coatings: Influence of a Nitrogen Atmosphere on the Soldering Performance, NEPCON West 1996.
8. M. Ehrlich, G.S. Laneus and G.E. Reichelt, Investigations about the Reliability of Atmospheric and Inert Wave-soldered 1812 Capacitors at Various Footprint Configurations, Proceedings of NEPCON West 1994.
9. Thibault, Bell and Lemieux, Reduction of Residues Using Various Atmospheres, Proceedings of NEPCON West 1998.
10. M. Gerhard and H.E. Kiecker, Quality Improvement by the Implementation of Reflow Soldering with Nitrogen, Productronica Conference, Munich, 1996.
11. C. Boeding, et al., Measuring the Benefits of Nitrogen for Reflow, NEPCON West 1997.
12. Pratt and Trumble, Process and Material Characterization for Lead-free Tin/Copper Solder Alloy, SMI Conference, San Jose, Calif., 1998. 1! National Center for Manufacturing Sciences: Leadfree Solder Project, Final Report, August 1997.