Effect of dissolution on the Ni3Sn4 growth kinetics at the interface of Ni and liquid Sn-base solders

Solid State Phenomena

Volumn 138, Issue , 2008, Pages 153-158

  Dybkov, V I ^a  

^a FRANTSEVICH INSTITUTE FOR PROBLEMS OF MATERIALS SCIENCE   (Ukraine)

Author keywords

Growth kinetics; Liquid Sn base solders; Ni3Sn4 intermetallic layer

Indexed keywords

BINARY ALLOYS; DISSOLUTION; GROWTH KINETICS; INTERMETALLICS; LEAD-FREE SOLDERS; NICKEL;

DIPPING TIME; INTERMETALLIC LAYER; MATHEMATICAL EQUATIONS;

TIN ALLOYS;

EID: 84984604989     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.138.153     Document Type: Article

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