Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates

Materials Science and Technology

Volumn 27, Issue 7, 2011, Pages 1157-1162

  Satyanarayan, ^a   Prabhu, K N ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA   (India)

Author keywords

Contact angle; IMCs; Lead free solders; Wettability; Work of adhesion

Indexed keywords

AL SUBSTRATE; CONTINUOUS LAYERS; IMCS; INTERFACIAL MICROSTRUCTURE; LEAD FREE SOLDERS; NICKEL COATED; SN-AG-ZN; SOLDER ALLOYS; WETTING BEHAVIOUR; WORK OF ADHESION;

ADHESION; ALUMINUM; CONTACT ANGLE; INTERMETALLICS; NICKEL; NICKEL COATINGS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SUBSTRATES; WETTING; ZINC;

TIN;

EID: 79960200103     PISSN: 02670836     EISSN: 17432847     Source Type: Journal    
DOI: 10.1179/026708310X12815992418337     Document Type: Article

References (21)

1. G. Kumar and K. N. Prabhu: Proc. Int. Conf. on 'Advanced materials and composites', Trivandrum, India, October 2007, National Institute for Interdisciplinary Science and Technology, 535-540.
2. X. Wang, Y. C. Liu, C. Wei, L. M. Yu, Z. M. Gao and Z. Z. Dong: Appl. Phys. A, 2009, 96A, 969-973.
3. R. A. Islam, Y. C. Chan, W. Jillek and S. Islam: Microelectron. J., 2006, 37, 705-713.
4. M. Kamal and E. S. Gouda: J. Mater. Sci.: Mater. Electron., 2008, 19, 81-84.
5. M. J. Rizvi, Y. C. Chan, C. Bailey, H. Lu, M. N. Islam and B. Y. Wu: J. Electron. Mater., 2005, 34, (8), 1115-1122.
6. X. R. Zhang, Z. F. Yuan, H. X. Zhao, L. K. Zang and J. Q. Li: Chin. Sci. Bull., 2010, 55, (9), 797-801.
7. H. H. Manko: 'Solder and soldering', 2nd edn; 1979, New York, McGraw-Hill.
8. Girish Kumar and K. N. Prabhu: Adv. Colloid Interf. Sci., 2007, 133, 61-89.
9. R. L. Xu, Y. C. Liu, Y. J. Han, C. Wei, X. Wang and L. M. Yu: J. Mater. Sci.: Mater. Electron., 2009, 20, 675-679.
10. Y.-Y. Chen and J.-G. Duh: J. Mater. Sci.: Mater. Electron., 2000, 11, 279-283.
11. Y. C. Liu, J. B. Wan and Z. M. Gao: J. Alloys Compd, 2008, 465, 205-209.
12. J. B. Wan, Y. C. Liu, C. Wei, P. Jiang and Z. M. Gao: J. Mater. Sci.: Mater. Electron., 2008, 19, 1160-1168.
13. S. Amore, E. Ricci, G. Borzone and R. Novakovic: Mater. Sci. Eng. A, 2008, A495, 108-112.
14. G. Ghosh: J. Electron. Mater., 2004, 33, (10), 1080-1091.
15. D. C. Lin, R. Kovacevic, T. S. Srivatsan and G. X.Wang: Sadhana, 2008, 33, (3), 251-259.
16. J. D. Dowd: 'Solders, fluxes, and techniques for soldering aluminum', STP 189-EB, ASTM, West Conshohocken, PA, USA, 1957, 5-13.
17. S. A. Vishenkov, V. M. Gostenina, V. S. Yekatova, I. A. Faykina and L. V. Filimonova: Met. Sci. Heat Treat., 1962, 4, 511-513.
18. http://www.boulder.nist.gov/div853/lead-free/part2.html#%202· 2·19 18 (accessed 7 October 2010).
19. S. Shimada, Y. Takada, J. Lee and T. Tanka: ISIJ Int., 2008, 48, (9), 1246-1250.
20. V. I. Dybkov: Solid State Phenom., 2008, 138, 153-158.
21. W. K. Choi and H. M. Lee: J. Electron. Mater., 1999, 28, (11), 1251-1255.