The bonding of nanowire assemblies using adhesive and solder

JOM

Volumn 57, Issue 12, 2005, Pages 60-64

  Gu, Zhiyong ^a   Ye, Hongke ^a   Gracias, David H ^a,b  

^a Johns Hopkins University   (United States)

^b JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

NANOCOMPONENTS; NANOWIRE ASSEMBLIES;

ADHESIVES; BONDING; NANOSTRUCTURED MATERIALS; SELF ASSEMBLY; SOLDERING;

NANOTECHNOLOGY;

EID: 32544448834     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-005-0185-z     Document Type: Article

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