CMOS MEMS capacitive absolute pressure sensor

Journal of Micromechanics and Microengineering

Volumn 23, Issue 5, 2013, Pages

  Narducci, M ^a   Yu Chia, L ^b   Fang, W ^b   Tsai, J ^a,c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITIVE ABSOLUTE PRESSURE SENSOR; CAPACITIVE PRESSURE SENSORS; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; ELECTRICAL CONNECTION; FABRICATION AND CHARACTERIZATIONS; LOW-TEMPERATURE PROCESS; MONOLITHIC INTEGRATION; PARALLEL PLATE CAPACITORS;

DEPOSITION; ELECTRIC CONNECTORS; ETCHING; MONOLITHIC INTEGRATED CIRCUITS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PRESSURE SENSORS;

PRODUCT DESIGN;

EID: 84878042936     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/5/055007     Document Type: Article

References (15)

1. Ko C-T, Wu I-P, Wang W-C, Huang C-H, Tseng S-H, Chen Y-L and Lu M S-C 2006 Proc. MEMS pp 642-5
2. Hsiung Y-S and Lu M S -C 2011 Proc. Tranducers pp 24-27
3. Buyong M R, Aziz N A and Majlis B Y 2011 Sains Malaysiana 40 259-66
4. Dai C-L and Liu M-C 2007 Japan. J. Appl. Phys. 46 843-8 (Pubitemid 47252935)
5. Sun C-M, Tsai M-H, Wang C, Liu Y-C and Fang W 2009 Proc. Tranducers pp 1730-3
6. Chen P-J, Saati S, Varma R, Humayun M and Tai Y-C 2010 J. Microelectromech. Syst. 19 721-34
7. Le H-P, Shah K, Singh J and Zayegh A 2005 Analog Integr. Circuits Signal Process. 48 21-31
8. Sun C-M, Wang C, Tsai M-H, Hsieh H-S and Fang W 2009 J. Micromech. Microeng. 19 015023
9. Wang C-C, Gogoi B-P, Monk D-J and Mastrangelo C-H 2000 J. Microelectromech. Syst. 9 538-543 (Pubitemid 32169017)
10. Dai C-L, Lu P-W, Chang C and Liu C-H 2009 Sensors 9 10158-70
11. Puers R 1993 Sensors Actuators A 37-38 93-105
12. Vaganov V 2010 Sensors Actuators 1 17-30
13. Tsai M-H, Sun C-M, Liu Y-C, Wang C and fang W 2009 J. Micromech. Microeng. 19 005017
14. Buyong M R, Aziz N A and Majlis B Y 2009 Adv. Mater. Res. 74 231-4
15. Chu J and Zhang D 2009 J. Micromech. Microeng. 19 095020