-
1
-
-
80052105285
-
-
Jul
-
C. W. Swonger, D. M, Bowers, and R. M. Stock, Fingermatrix, Inc., US Patent 4,210,899, Jul. 1980.
-
(1980)
Fingermatrix Inc., US Patent 4, 210, 899
-
-
Swonger, C.W.1
Bowers, D.M.2
Stock, R.M.3
-
2
-
-
14244269672
-
Thermal characterization of micro heater arrays on a polyimide film substrate for fingerprint sensing applications
-
J. Han, Z. Tan, K. Sato, and M. Shikida, "Thermal characterization of micro heater arrays on a polyimide film substrate for fingerprint sensing applications," J. Micromech. Microeng., vol. 15, pp. 282-289, 2005.
-
(2005)
J. Micromech. Microeng.
, vol.15
, pp. 282-289
-
-
Han, J.1
Tan, Z.2
Sato, K.3
Shikida, M.4
-
3
-
-
80052119409
-
-
AT77C101B FingerChipTM Datasheet, Atmel Corp., San Jose, CA, USA
-
AT77C101B FingerChipTM Datasheet, Atmel Corp., San Jose, CA, USA.
-
-
-
-
4
-
-
4344591742
-
A sweeping mode integrated fingerprint sensor with 256 tactile microbeams
-
Aug
-
B. Charlot, F. Parrain, N. Galy, S. Basrour, and B. Courtois, "A sweeping mode integrated fingerprint sensor with 256 tactile microbeams," J. Microelectromech. Syst., vol. 13, no. 4, pp. 636-644, Aug. 2004.
-
(2004)
J. Microelectromech. Syst.
, vol.13
, Issue.4
, pp. 636-644
-
-
Charlot, B.1
Parrain, F.2
Galy, N.3
Basrour, S.4
Courtois, B.5
-
5
-
-
0033115597
-
A 600-dpi capacitive finger print sensor chip and image-synthesis technique
-
Apr
-
J. W. Lee, D. J. Min, J. Kim, and W. Kim, "A 600-dpi capacitive finger print sensor chip and image-synthesis technique, "IEEE J. Solid-State Circuits, vol. 34, pp. 469-475, Apr. 1999.
-
(1999)
IEEE J. Solid-State Circuits
, vol.34
, pp. 469-475
-
-
Lee, J.W.1
Min, D.J.2
Kim, J.3
Kim, W.4
-
6
-
-
0031649116
-
A fingerprint sensor based on the feedback capacitive sensing scheme
-
Jan
-
M. Tartagni and R. Guerrieri, "A fingerprint sensor based on the feedback capacitive sensing scheme," IEEE J. Solid-State Circuits, vol. 33, no. 1, pp. 133-142, Jan. 1998.
-
(1998)
IEEE J. Solid-State Circuits
, vol.33
, Issue.1
, pp. 133-142
-
-
Tartagni, M.1
Guerrieri, R.2
-
7
-
-
0033363024
-
A low-power and high-performance CMOS fingerprint sensing and encoding architecture
-
S. Jung, R. Thewes, T. Scheither, K. Goser, and W. Weber, "A low-power and high-performance CMOS fingerprint sensing and encoding architecture," IEEE J. Solid-State Circuits, vol. 34, pp. 978-984, 1999.
-
(1999)
IEEE J. Solid-State Circuits
, vol.34
, pp. 978-984
-
-
Jung, S.1
Thewes, R.2
Scheither, T.3
Goser, K.4
Weber, W.5
-
8
-
-
0000616369
-
A novel sensor cell architecture and sensing circuit scheme for capacitive fingerprint sensors
-
H. Morimura, S. Shigematsu, and K. Machida, "A novel sensor cell architecture and sensing circuit scheme for capacitive fingerprint sensors," IEEE J. Solid-State Circuits, vol. 35, pp. 724-731, 2000.
-
(2000)
IEEE J. Solid-State Circuits
, vol.35
, pp. 724-731
-
-
Morimura, H.1
Shigematsu, S.2
Machida, K.3
-
9
-
-
77951668073
-
Capacitive-sensing circuit technique for image quality improvement on fingerprint sensor LSIs
-
T. Shimamura, H. Morimura, S. Shigematsu, M. Nakanishi, and K. Machida, "Capacitive-sensing circuit technique for image quality improvement on fingerprint sensor LSIs," IEEE J. Solid-State Circuits, vol. 45, pp. 1080-1087, 2010.
-
IEEE J. Solid-State Circuits
, vol.45
, Issue.2010
, pp. 1080-1087
-
-
Shimamura, T.1
Morimura, H.2
Shigematsu, S.3
Nakanishi, M.4
Machida, K.5
-
10
-
-
18844425993
-
Novel surface structure and its fabrication process for MEMS fingerprint sensor
-
May
-
N. Sato, S. Shigematsu, H. Morimura, M. Yano, K. Kudou, T. Kamei, and K. Machida, "Novel surface structure and its fabrication process for MEMS fingerprint sensor," IEEE Trans. Electron Devices, vol. 52, no. 5, pp. 1026-1032, May 2005.
-
(2005)
IEEE Trans. Electron Devices
, vol.52
, Issue.5
, pp. 1026-1032
-
-
Sato, N.1
Shigematsu, S.2
Morimura, H.3
Yano, M.4
Kudou, K.5
Kamei, T.6
Machida, K.7
-
11
-
-
0030689090
-
A very high density bulk micromachined capacitive tactile imager
-
Chicago, June 16-19
-
R. J. De Souza and K. D. Wise, "A very high density bulk micromachined capacitive tactile imager," Int. Conf. on Solid-State Sensors and Actuators (Transducers), pp. 1473-1476, Chicago, June 16-19, 1997.
-
(1997)
Int. Conf. on Solid-State Sensors and Actuators (Transducers)
, pp. 1473-1476
-
-
De Souza, R.J.1
Wise, K.D.2
-
12
-
-
0030719685
-
A high density capacitive pressure sensor array for fingerprint sensor application
-
Chicago, June 16-19
-
P. Rey, P. Charvet, M. T. Delaye, and S. Abou Hassan, "A high density capacitive pressure sensor array for fingerprint sensor application," Int. Conf. on Solid-State Sensors and Actuators (Transducers), pp. 1453-1456, Chicago, June 16-19, 1997.
-
(1997)
Int. Conf. on Solid-State Sensors and Actuators (Transducers)
, pp. 1453-1456
-
-
Rey, P.1
Charvet, P.2
Delaye, M.T.3
Abou Hassan, S.4
-
13
-
-
33746277063
-
A highly sensitive CMOS-MEMS capacitive tactile sensor
-
Istanbul, Turkey, Jan. 22-26
-
C.-T. Ko, J.-P. Wu, W.-C. Wang, C.-H. Huang, S.-H. Tseng, Y.-L. Chen, and M. S.-C. Lu, "A highly sensitive CMOS-MEMS capacitive tactile sensor," 19th IEEE Int. Conf. on Micro Electro Mech. Syst., pp. 642-645, Istanbul, Turkey, Jan. 22-26, 2006.
-
(2006)
19th IEEE Int. Conf. on Micro Electro Mech. Syst.
, pp. 642-645
-
-
Ko, C.-T.1
Wu, J.-P.2
Wang, W.-C.3
Huang, C.-H.4
Tseng, S.-H.5
Chen, Y.-L.6
Lu, M.S.-C.7
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