Characterization and optimization of seals-off for Very Low Pressure Sensors (VLPS) fabricated by CMOS MEMS process

Advanced Materials Research

Volumn 74, Issue , 2009, Pages 231-234

  Buyong, Muhamad Ramdzan ^a   Aziz, Norazreen Abd ^a   Majlis, Burhanuddin Yeop ^a  

^a INSTITUTE OF MICROENGINEERING AND NANOELECTRONICS IMEN   (Malaysia)

Author keywords

Bulk micromachining; CMOS MEMS compatible; CMOS MEMS product; Surface micromachining

Indexed keywords

BOTTOM ELECTRODES; BULK- MICROMACHINING; CAPACITIVE PRESSURE SENSORS; CMOS-MEMS; ETCH HOLE; FABRICATION PROCESS; LOW PRESSURES; PARALLEL PLATES; PROCESS CHARACTERIZATION; PROCESS DEVELOPMENT; PROCESSING FLOW; PRODUCT SURFACE; RELEASE ETCH; THIN LAYERS; THREE STAGES;

COMPOSITE MICROMECHANICS; FABRICATION; MEMBRANE STRUCTURES; MICROELECTROMECHANICAL DEVICES; PARTIAL PRESSURE SENSORS; PRESSURE SENSORS; PRESSURE TRANSDUCERS; SURFACE MICROMACHINING; SURFACE MOUNT TECHNOLOGY; SURFACES; THIN FILMS;

MEMS;

EID: 73549118597     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.74.231     Document Type: Conference Paper

References (4)

1. Lawrence J. Schwartz, MD "Glaucoma" http://www.medicinenet.com/
2. Gunther Zimmer United States Patent 5,431,057 (1995) "Integratable Capacitive Pressure Sensor and Process for its Manufacture"
3. Henry Guckel United States Patent 4,744,863 (1988) "Sealed Cavity Semiconductor Pressure Transducers and Method of Producing the same".
4. H. Berney "Critical Processing Issues for Micromachined Sacrificial Layer Etching and Sealing", Sensor and Actuators 76 (1999) 356-364