The effect of flow properties on filler settling of underfill in the flip chip package

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 761-766

  Wang, Jinlin ^a   Chen, Tim ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURVE FITTING; ELECTRONICS PACKAGING; GLASS TRANSITION; STRESS ANALYSIS; THROUGHPUT; VISCOSITY; YIELD STRESS;

BINGHAM FLUID DEFORM; BUMP LAYER METALLIZATION (BLM); UNDERFILL FLOW; UNDERFILL LAYERS;

FLIP CHIP DEVICES;

EID: 10444257168     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Mathew K. Schwiebert and William H. Leong, "Underfill Flow as Viscous Flow Between Parallel Plates driven by Capillary Action", IEEE Transactions on Components, Packaging, and Manufacturing Technology- Part C, Vol. 19, No. 2, pp. 133-137, April, 1996.
2. Y.C. Chia et al., "A Study of Underfill Dispensing Process", The International Journal of Microcircuits and electronic Packaging, Vol. 22, No. 4, pp. 345-352, Fourth Quarter, 1999.
3. Gary L. Lehmann et al., "Underflow Process for Direct-Chip-Attachment Packaging", IEEE Transactions on Components, Packaging, and Manufacturing Technology- Part A, Vol. 21, No. 2, pp. 266-274, June, 1998.
4. H.A. Barnes, J.F. Hutton, and K. Waters, "Introduction to Rheology", Elsevier, Amsterdam, 1989.
5. R.P. Chhabra, "Bubbles, drops, and particles in non-Newtonian fluids", CRC Press, Boca Raton, 1993.
6. R.B. Bird, W.E. Steward, and E.N. Lightford, "Transport Phenomena", John Wiley and Sons, New York, 1962.
7. J. Wang, "Flow time measurements for underfill in flip-chip packaging", Proc. ICEP 2002 Conference, pp 221-226, Tokyo, Japan, April 17-19, 2002.
8. Sejin Han and K.K. Wang, "Analysis of the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips," IEEE Transactions on Components, Packaging, and Manufacturing Technology- Part B, Vol. 20, No. 4, pp. 424-432, November, 1997.
9. J.P. Hartnett and R.Y.Z. Hu, "The yield stress: an engineering reality", J. Rheol., Vol. 33, pp. 671-679, 1989.
10. Q.D. Nguyen and D.V. Boger, "Yield stress measurement for concentrated suspension", J. Rheol., Vol. 27, pp. 321-349, 1983.
11. A.S. Yoshimura, R.K. Prud'homme, H.M. Princen, and A.D. Kiss, "A comparison of techniques for measuring yield stresses", J. Rheol., Vol. 31, pp. 699-710, 1987.