Melting of metallic electrodes and their flowing through a carbon nanotube channel within a device

Advanced Materials

Volumn 25, Issue 19, 2013, Pages 2693-2699

  Zou, Rujia ^a   Zhang, Zhenyu ^a   Liu, Qian ^a   Xu, Kaibing ^a   Lu, Aijiang ^a   Hu, Junqing ^a   Li, Quan ^b   Bando, Yoshio ^c   Golberg, Dmitri ^c  

^a DONGHUA UNIVERSITY   (China)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

^c NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

carbon nanotube; devices; dynamics; electrical properties; electrode melting

Indexed keywords

DEVICES; ELECTRICAL CIRCUIT; ELECTRICAL PERFORMANCE; ELECTROMIGRATION FORCES; ELECTRONIC DEVICE; IN-SITU OBSERVATIONS; METAL ELECTRODE MATERIALS; METALLIC ELECTRODES;

CARBON NANOTUBES; DYNAMICS; ELECTRODES; MELTING; MULTIWALLED CARBON NANOTUBES (MWCN);

ELECTRIC PROPERTIES;

CARBON NANOTUBE; METAL;

ARTICLE; CHEMISTRY; ELECTRODE; EQUIPMENT DESIGN; EQUIPMENT FAILURE; HEAT; MATERIALS TESTING; THERMAL CONDUCTIVITY; ULTRASTRUCTURE;

ELECTRODES; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; HOT TEMPERATURE; MATERIALS TESTING; METALS; NANOTUBES, CARBON; THERMAL CONDUCTIVITY;

EID: 84877735230     PISSN: 09359648     EISSN: 15214095     Source Type: Journal    
DOI: 10.1002/adma.201300257     Document Type: Article

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