The road to the next generation power module ? 100% solder free design

2008 5th International Conference on Integrated Power Systems, CIPS 2008

Volumn , Issue , 2008, Pages

  Scheuermann, Uwe ^a   Beckedahl, Peter ^a  

^a Research Development Modules and Chips Semikron Elektronik GmbH Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; RELIABILITY; SINTERING;

BASE PLATES; MODULE ARCHITECTURE; POWER MODULE; PRESSURE CONTACTS; SOLDER FATIGUE; SOLDER INTERFACES; SOLDER LAYERS;

ELECTRIC POWER SYSTEMS;

EID: 84991238523     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

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3. Scheuermann, U.; Lutz, J.: High voltage power module with extended reliability, Proc. EPE99, Lausanne, CD-ROM (1999)
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5. Scheuermann, U.: Advanced Power Modules with AlN-substrats-extending current capability and lifetime, Proc. PCIM, PE 12.5, pp. 309-314, Nürnberg, 2003
6. Lang, F.; Scheuermann, U.: Reliability of Spring Pressure Contacts under Environmental Stress, Microelectronics Reliability 47 (2007), pp. 1761-1766
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8. Slade, P.: Electrical Contacts-Principles and Applications, Marcel Dekker, New York, 1999
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10. Beckedahl, P.; Grasshoff, T.; Lederer, M.: A new power module concept for automotive applications, PCIM, Nürnberg, 2007
11. Wintrich, A.; Beckedahl, P.; Wurm, T.: Electrical and thermal optimization of an automotive power module family, APE Conference Paris, 2007
12. Scheuermann, U.; Wiedl, P.: Low Temperature Joining Technology-A High Reliability Alternative to Solder Contacts, Workshop on Metal Ceramic Composites for Functional Applications, 181-192, Wien, 1997
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15. Amro, R.; Lutz, J.; Rudzki, J.; Thoben, M.; Lindemann, A.: Double-Sided Low-Temperature Joining Technique for Power Cycling Capability at High Temperature, EPE 2005, Dresden, CDROM
16. Scheuermann, U.; Hecht, U.: Power Cycling Lifetime of Advanced Power Modules for Different Temperature Swings, Proc. PCIM, PE4.5, pp. 59-64, Nürnberg, 2002
17. Mourick, P.; Steger, J.; Tursky, W.: 750 A, 75 V MOSFET Power Module with Sub-nH Inductance, Proc. PCIM, PE4.5, pp. 59-64, Nürnberg, 2002