Characteristics of high-purity Cu thin films deposited on polyimide by radio-frequency Ar/H2 atmospheric-pressure plasma jet

Journal of Applied Physics

Volumn 113, Issue 12, 2013, Pages

  Zhao, P ^a,b   Zheng, W ^c   Meng, Y D ^b   Nagatsu, M ^a  

^a SHIZUOKA UNIVERSITY   (Japan)

^b INSTITUTE OF PLASMA PHYSICS   (China)

^c YAZAKI CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE PLASMAS; AUGER SPECTROSCOPY; FILM CHARACTERISTICS; FLEXIBLE ELECTRONIC DEVICES; POLYIMIDE SUBSTRATE; RADIO-FREQUENCY POWER; REDUCTION REACTION; ROTATIONAL TEMPERATURE;

DEPOSITS; EVAPORATION; HYDROGEN; METALLIC FILMS; PHASE TRANSITIONS; PLASMA JETS; POLYIMIDES; THIN FILMS; WIRE;

COPPER;

EID: 84875790831     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4795808     Document Type: Article

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