Dissipating heat from hot spot using a new nano thermal interface material

ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2012, Pages 171-176

  Sun, Shuangxi ^a   Mu, Wei ^a,b   Zhang, Yan ^a   Carlberg, Bjorn ^b   Ye, Lilei ^c   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

DISSIPATION EFFECTS; ELECTRONIC PACKAGING; INTERFACE MATERIALS; MICROELECTRONIC COMPONENTS; POLYMER-METAL COMPOSITE; POWER DISTRIBUTIONS; SEMICONDUCTOR PROCESS; THERMAL INTERFACE MATERIALS;

CHIP SCALE PACKAGES; COMPOSITE FILMS; MICROELECTRONICS; THERMAL INSULATING MATERIALS;

INTERFACES (MATERIALS);

EID: 84875437462     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT-HDP.2012.6474593     Document Type: Conference Paper

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