Thermal measurement and modeling of multi-die packages

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 2, 2009, Pages 484-492

  Poppe, András ^a   Zhang, Yan ^c,d   Wilson, John ^a   Farkas, Gábor ^a   Szabó, Péter ^b   Parry, John ^a   Rencz, Márta ^e   Székely, Vladimír ^e  

^a MENTOR GRAPHICS CORPORATION   (United States)

^b MicReD Ltd   (Hungary)

^c Flomerics Inc   (United States)

^d Tessera Inc   (United States)

^e BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Compact thermal modeling; Multi die packages; Stacked die package modeling; Structure functions; Thermal transient testing

Indexed keywords

COMPACT THERMAL MODELING; MULTI-DIE PACKAGES; STACKED-DIE PACKAGE MODELING; STRUCTURE FUNCTIONS; THERMAL TRANSIENT TESTING;

CHIP SCALE PACKAGES; DIES; MULTICHIP MODULES; THERMAL VARIABLES MEASUREMENT; THERMOANALYSIS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 68349141350     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2004578     Document Type: Article

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