메뉴 건너뛰기




Volumn 20, Issue , 2004, Pages 168-176

Electric and thermal transient effects in high power optical devices

Author keywords

Combined photometric thermal measurement of power LEDs; Structure function based thermal modeling; Thermal and electro thermal simulation; Thermal transient measurement

Indexed keywords

COOLING TRANSIENT; COPPER COOLING; STRUCTURE FUNCTIONS; THERMAL TRANSIENT;

EID: 2342621339     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (50)

References (10)
  • 1
    • 33746374184 scopus 로고    scopus 로고
    • Thermal investigation of high power optical devices by transient testing
    • Aix-en-Provence, France, Sep
    • G. Farkas, Q. van Voorst Vader, A. Poppe, Gy. Bognár: Thermal investigation of high power optical devices by transient testing, Proc. of the 9th THERMINIC, Aix-en-Provence, France, Sep 2003
    • (2003) Proc. of the 9th Therminic
    • Farkas, G.1    Van Voorst Vader, Q.2    Poppe, A.3    Bognár, Gy.4
  • 2
    • 0018262034 scopus 로고
    • Measuring thermal resistance is the key to a cool semiconductor
    • B.S. Siegel: Measuring thermal resistance is the key to a cool semiconductor, Electronics,V.51,pp.121-126 (1978)
    • (1978) Electronics , vol.51 , pp. 121-126
    • Siegel, B.S.1
  • 3
    • 0024069775 scopus 로고
    • Fine structure of heat flow path in semiconductor devices: A measurement and identification method
    • V. Székely and Tran Van Bien: Fine structure of heat flow path in semiconductor devices: a measurement and identification method, Solid-State Electronics, V.31, pp.1363-1368 (1988)
    • (1988) Solid-state Electronics , vol.31 , pp. 1363-1368
    • Székely, V.1    Van Bien, T.2
  • 4
    • 84862348269 scopus 로고    scopus 로고
    • www.micred.com/strfunc.html
  • 5
    • 84862349487 scopus 로고    scopus 로고
    • Structure function evaluation of stacked dies
    • March,San Jose,CA,USA, in this issue
    • M.Rencz,V.Székely:Structure function evaluation of stacked dies Proc. of SEMI-THERM XX, March 2003,San Jose,CA,USA, in this issue
    • (2003) Proc. of Semi-therm XX
    • Rencz, M.1    Székely, V.2
  • 6
    • 0032041533 scopus 로고    scopus 로고
    • THERMODEL: A tool for compact dynamic thermal model generation
    • April - May
    • V. Székely: THERMODEL: a tool for compact dynamic thermal model generation, Microelectronics Journal, V.29, Issues 4-5, (April - May 1998)
    • (1998) Microelectronics Journal , vol.29 , Issue.4-5
    • Székely, V.1
  • 7
    • 0037272310 scopus 로고    scopus 로고
    • Compact models of cooling mounts for fast board level design
    • March, San Jose,CA,USA
    • G. Farkas, A. Poppe, E. Kollár, P.Stehouwer: Compact models of cooling mounts for fast board level design. Proc of SEMI-THERM XIX, March 2003, San Jose,CA,USA, pp. 255-262
    • (2003) Proc of Semi-therm XIX , pp. 255-262
    • Farkas, G.1    Poppe, A.2    Kollár, E.3    Stehouwer, P.4
  • 8
    • 84862346035 scopus 로고    scopus 로고
    • http://www.cie.co.at/publ/list.html#standard
  • 9
    • 84862348270 scopus 로고    scopus 로고
    • www.micred.com/t3ster.html


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.