Enhanced thermoelectric cooler for on-chip hot spot cooling

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 249-258

  Wang, Peng ^a   Bar Cohen, Avram ^a   Yang, Bao ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Bi2Te3; Mini contact; Onchip hot spot; Thermal contact resistance; Thermal management; Thermoelectric cooer

Indexed keywords

HOT SPOT COOLING; MINI-CONTACT; THERMOELECTRIC COOLER; THERMOELECTRIC COOLING POWER;

COMPUTER SIMULATION; CONTACT RESISTANCE; ENERGY DISSIPATION; MICROPROCESSOR CHIPS; TEMPERATURE CONTROL; THERMAL GRADIENTS; THERMOELECTRIC EQUIPMENT;

COOLING SYSTEMS;

EID: 40449130937     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33798     Document Type: Conference Paper

References (28)