Thermal management of on-chip hot spots and 3D chip stacks

2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009

Volumn , Issue , 2009, Pages

  Bar Cohen, Avram ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

3D packaging; Hot spot; Immersion cooling; Thermoelectric cooling

Indexed keywords

3D PACKAGING; CHIP PACKAGES; COMMERCIAL IMPLEMENTATION; CONVENTIONAL APPROACH; COOLING TECHNIQUE; CRITICAL PATHS; HEAT DENSITY; HOT SPOT; IC PACKAGING; IMMERSION COOLING; LIQUID COOLING; MOORE'S LAW; ON CHIPS; RESEARCH CHALLENGES; ROADMAP; THERMAL CHARACTERISTICS; THERMAL MANAGEMENT; THERMOELECTRIC COOLER; THERMOELECTRIC COOLING;

CHIP SCALE PACKAGES; COOLING; MICROWAVE ANTENNAS; MICROWAVES; PACKAGING; PRODUCT DEVELOPMENT; RADIO WAVES; TECHNOLOGICAL FORECASTING; TEMPERATURE CONTROL; THERMOELECTRIC EQUIPMENT; THERMOELECTRIC REFRIGERATION; THERMOELECTRICITY; THREE DIMENSIONAL;

DIELECTRIC LIQUIDS;

EID: 77949857441     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/COMCAS.2009.5385939     Document Type: Conference Paper

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