Moisture diffusion and integrated stress analysis in LED module

ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2012, Pages 1308-1313

  Gong, Yu Bing ^a   Xu, Jia Bing ^a  

^a GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY   (China)

Author keywords

FEM; LED; moisture; reflow; reliability

Indexed keywords

FINITE ELEMENT MODELS; INITIAL MOISTURE; INTEGRATED STRESS; MOISTURE DIFFUSION; MOISTURE DISTRIBUTION; OPERATION CONDITIONS; REFLOW; REFLOW--SOLDERING;

DIFFUSION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; LIGHT EMITTING DIODES; RELIABILITY; STRESS ANALYSIS; THERMAL STRESS;

MOISTURE;

EID: 84875426950     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT-HDP.2012.6474846     Document Type: Conference Paper

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