Effect of temperature and moisture on LED reliability and its mechanism analysis

Bandaoti Guangdian/Semiconductor Optoelectronics

Volumn 30, Issue 3, 2009, Pages 366-370

  Luo, Xiao Bing ^a,b   Yang, Jiang Hui ^a   Liu, Sheng ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

LED; Moisture distribution; Reliability; Thermal stress

Indexed keywords

EID: 72749125472     PISSN: 10015868     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. Narendran N, Gu Y M. Life of LED-based white light sources [J]. IEEE J. Display Technol., 2005, 1 (1): 167-171.
2. Hu J Z, Yang L Q, Hwang W J, et al. Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages [J]. J. Crystal Growth, 2006, 288 (1): 157-161.
3. Hu J Z. Thermal effects of moisture inducing delamination in light-emitting diode packages [C] //Electronic Components and Technology Conference, 2006: 1957-1962.
4. Hu J Z, Yang L Q, Shin Moo Whan. Mechanism and thermal effect of delamination in light-emitting diode packages [J]. Microelectronics Journal, 2007, 38: 157-163.
5. Hu J Z, Yang L Q, Shin Moo Whan. Electrical, optical and thermal degradation of high power GaN/InGaN light-emitting diodes [J]. J. Phys. D: Appl. Phys., 2008, 41 (3): 035107.
6. DeMilo C, Bergad C, Forni R, et al. Thermally induced stresses resulting from coefficient of thermal expansion differentials between an LED sub-mount material and various mounting substrates [J]. Proc. of SPIE, 2007, 6486: 1-10.
7. 2005, 16 (5): 511-514.
8. 2005, 26 (2): 87-91.
9. 2007, 28 (5): 627-630.
10. 2005, 26 (2): 118-120.
11. 2007, 47 (8): 1380-1383.
12. 2005: 44.