Moisture diffusion and integrated stress analysis in encapsulated microelectronics devices

2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011

Volumn , Issue , 2011, Pages

  Fan, Xuejun ^a   Zhao, Jie Hua ^b  

^a Lamar University   (United States)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BI-MATERIAL; CONTINUITY EQUATIONS; CONTINUUM THEORY; COUPLED PROBLEMS; DAMAGE PROGRESSION; EFFECTIVE STRESS; FIELD VARIABLES; GOVERNING EQUATIONS; HYGROSCOPIC SWELLING; INTERNAL FIELD; MATERIAL DEFORMATION; MOISTURE CONCENTRATION; MOISTURE DIFFUSION; MOISTURE EVAPORATION; MULTI-FIELD; MULTI-FIELD PROBLEM; THEORETICAL FRAMEWORK; TIME-DEPENDENT PROCESS; VOID GROWTH; VOID VOLUME FRACTION; VOLUMETRIC STRAIN;

CONTINUUM MECHANICS; DIFFUSION; DRIERS (MATERIALS); ELASTICITY; EVAPORATION; EXPERIMENTS; HYDROSTATIC PRESSURE; MICROELECTRONICS; MICROSYSTEMS; PHASE TRANSITIONS; PRESSURE EFFECTS; STRESS ANALYSIS; SWELLING; THERMAL EXPANSION; TITRATION; VAPOR PRESSURE; VAPORS; VOID FRACTION;

MOISTURE;

EID: 79957909666     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2011.5765793     Document Type: Conference Paper

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