Thermal effects of moisture inducing delamination in light-emitting diode packages

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1957-1962

  Jianzheng, Hu ^a   Lianqiao, Yang ^a   Moo, Whan Shin ^a  

^a Myong Ji University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT TESTING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; LIGHT EMITTING DIODES; MICROPROCESSOR CHIPS; MOISTURE; THERMAL EFFECTS;

HEAT BLOCK TESTING; HYGROMECHANICAL STRESSES; THERMAL CHARACTERISTICS; TRANSIENT THERMAL MEASUREMENTS;

DELAMINATION;

EID: 33845580674     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645928     Document Type: Conference Paper

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